SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard

Place of Origin China
Brand Name KAIJIN
Certification ISO 9001:2015
Model Number PCBA
Minimum Order Quantity 100+
Packaging Details Fully featured
Delivery Time 10
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 6000

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Product Details
Processing Type Customized Processing Method Any Way
Processing Equipment High-speed Placement Machine, Reflow Soldering, Wave Soldering, AI, AOI, X-RAY, Etc Quality Certification Standard Integration Management System, ISO9
Number Of Processing Equipment 50 Sets Number Of Production Lines 5
Daily Processing Capacity 6 Million Points Lead-free Manufacturing Process Yes
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SMT PCB Assembly And Soldering

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PCB Assembly And Soldering DIP

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Product Description

SMT Chip Processing DIP Soldering Video Surveillance Terminal Motherboard

 

Product parameters

 

 
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
 
 
 
 
 
 
 
 
 
 
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

 

 

 
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
 
 
 
 
 
 
 
 
 
 
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;
 
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
 
 
 
 
 
 
 
 
 
 
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

 

SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard 0SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard 1SMT PCB Assembly And Soldering DIP Video Surveillance Terminal Motherboard 2

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Helping clients solve design issues over 500 times
Helped customers solve MP issues over 800 times.
Helping customers improve testing reliability over 1000 times
2,Quality control
ISO9001: 2015
ISO13485
IATF16949
MES
Traceability system
Fully automatic FCT testing
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Quick response principle within 1 hour
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