GSM Wireless Communication Module Printed Circuit Board Assembly Services

Place of Origin Guang Dong CHINA
Brand Name KAIJIN
Certification ISO9001,ISO14001,ROHS,CQC
Model Number X-158763
Minimum Order Quantity 100
Price Bargain
Packaging Details Full Type of packaging
Delivery Time 5-7 work days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 1000

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Product Details
Min. Line Width 0.1mm Base Material FR-4/Aluminum
Min. Line Spacing 4/4mil(0.1/0.1mm) Board Thickness 0.2mm--3.2mm
Surface Finishing OSP Copper Thickness 1/2OZ 1OZ 2OZ 3OZ
Min. Hole Size 0.1mm(4mil) Hole 0.20mm
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GSM Communication Module

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Communication Printed Circuit Board Assembly Services

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ODM Printed Circuit Board Assembly Services

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Product Description

Customized GSM wireless communication module PCB assembly manufacturer

 

Product parameters

 

 
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
 
 
 
 
 
 
 
 
 
 
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

 

 

 
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
 
 
 
 
 
 
 
 
 
 
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;
 
Types of Assembly
SMT (Surface-Mount Technology)
THD (Thru-Hole Device)
SMT & THD mixed
Double sided SMT and THD assembly
 
 
 
 
 
 
 
 
 
 
SMT capability
PCB layer: 1-32 layers;
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
Board type: Rigid FR-4, Rigid-Flex boards
PCB thickness: 0.2mm-7.0mm;
PCB dimension width: 40-500mm;
Copper thickness: Min:0.5oz; Max: 4.0oz;
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
Component size: 0.6*0.3mm-33.5*33.5mm;
Component height: 6mm(max);
Pin spacing laser recognition over 0.65mm;
High resolution VCS 0.25mm;
BGA spherical distance: ≥0.25mm;
BGA Globe distance: ≥0.25mm;
BGA ball diameter: ≥0.1mm;
IC foot distance: ≥0.2mm;

 

Company Introduction

Guangzhou Kaijin Precision Manufacturing Co., Ltd. is a focus on the electronics industry SMT/DIP high-end circuit board processing, the company has 60 employees, the existing high-speed patch production line four, 3 new YAMAMHA patch lines, a total of 6 machines, 1 SONY patch production line a total of 2 sets, offline AOI inspection equipment 4 sets, daily average patch production capacity of 6 million points, plug-in production lines 2, tin production line 2, new lead-free wave soldering, daily average production capacity of 1.2 million points, Lead-free assembly 30-meter production line 2, daily assembly of about 3,000 products, peripheral auxiliary equipment is perfect, can ensure the integrity of product quality, many places to achieve automated processes, for customers
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